Datasheet
A Y
SN54HC14, SN74HC14
SCLS085G –DECEMBER 1982–REVISED JANUARY 2014
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Function Table
(Each Inverter)
INPUTS OUTPUT
A Y
H L
L H
Logic Diagram (Positive Logic)
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 7 V
I
IK
Input clamp current
(2)
V
I
< 0 or V
I
> V
CC
±20 mA
I
OK
Output clamp current
(2)
V
O
< 0 ±20 mA
I
O
Continuous output current V
O
= 0 to V
CC
±25 mA
Continuous current through V
CC
or GND ±50 mA
D package 86
DB package 96
θ
JA
Package thermal impedance
(3)
N package 80 °C/W
NS package 76
PW package 113
T
stg
Storage temperature range –60 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
(1)
SN54HC14 SN74HC14
UNIT
MIN NOM MAX MIN NOM MAX
V
CC
Supply voltage 2 5 6 2 5 6 V
V
I
Input voltage 0 V
CC
0 V
CC
V
V
O
Output voltage 0 V
CC
0 V
CC
V
T
A
Operating free-air temperature –55 125 –40 85 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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