Datasheet
4
SN54HC132
SN74HC132
SCLS034G –DECEMBER 1982 –REVISED JUNE 2016
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
CC
Supply voltage –0.5 7 V
I
IK
Input clamp current
(2)
V
I
< 0 or V
I
> V
CC
±20 mA
I
OK
Output clamp current
(2)
V
O
< 0 or V
O
> V
CC
±20 mA
I
O
Continuous output current V
O
= 0 to V
CC
±25 mA
Continuous current through V
CC
or GND ±50 mA
T
J
Junction temperature 150 °C
T
stg
Storage temperature –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1000
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs.
6.3 Recommended Operating Conditions
See
(1)
MIN NOM MAX UNIT
V
CC
Supply voltage 2 5 6 V
V
I
Input voltage 0 V
CC
V
V
O
Output voltage 0 V
CC
V
T
A
Operating free-air temperature
SN54HC132 –55 125
°C
SN74HC132 –40 85
(1) For more information about traditional and new thermal metrics, see the application report, Semiconductor and IC Package Thermal
Metrics.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.
6.4 Thermal Information
THERMAL METRIC
(1)
SN74HC132
UNIT
D
(SOIC)
DB
(SSOP)
N
(PDIP)
NS
(SO)
PW
(TSSOP)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
R
θJA
Junction-to-ambient thermal resistance
(2)
84.3 99.1 50.9 84.3 113.3 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 44.8 51.3 38.2 42.2 42.8 °C/W
R
θJB
Junction-to-board thermal resistance 38.5 46.3 30.8 43.0 54.8 °C/W
ψ
JT
Junction-to-top characterization parameter 13.9 17.7 23.1 13.5 4.0 °C/W
ψ
JB
Junction-to-board characterization parameter 38.2 45.8 30.7 42.7 54.3 °C/W