Datasheet

GTLP EVM Overview
7–310
1.1 GTLP EVM Overview
The EVM can be used to evaluate device parameters, while acting as a guide
for high-speed board layout. Because GTLP operates over a wide range of
frequencies, designers must optimize their designs for the frequency of
interest. Additionally, designers can use buried transmission lines and provide
additional noise attenuation and EMI suppression to optimize their
end product.
The board layout is designed and optimized to support high-speed operation
up to 100 MHz. Thus, understanding impedance control and transmission-line
effects are crucial when designing high-speed boards.
Some of the advanced features offered by this board include:
- The backplane printed circuit board (PCB) is designed for high-speed
signal integrity, while the daughter card is designed with integral
measurement points for easily measuring signal integrity.
- Subminiature A connectors (SMA) as specified by MIL-C-39012 coaxial
connector specification and parallel fixtures easily are connected to test
equipment.
- The first bit of each group of input/output signals is accessible for rapid
prototyping.