Datasheet

7–309
Introduction
The Texas Instruments (TI) GTLP evaluation module (EVM) board is used to
evaluate the SN74GTLPH1655 in multipoint data-transmission applications in
a heavily loaded backplane.
The GTLP EVM is a 17.9-in., 20-slot, 0.94-in.-pitch, 8-layer PC backplane
board that provides a total of 48 parallel data lines divided into 6 groups of 8
bits staggered into various lengths. The EVM also includes a 1-bit clock along
the length of the backplane showing source-synchronous transfer mode. This
board allows the designer to connect 50-Ω unloaded parallel buses to the
transmitter and receiver connectors in a backplane configuration.
New-design backplane-driver selection criteria are based on drive capability,
live-insertion capability, data throughput, noise margin, backward
compatibility, and bus configuration. The purpose of the GTLP EVM is to
demonstrate the performance of the TI GTLP product portfolio in a
best-in-class high-performance backplane. The backplane enables users to
observe the effects of different kinds of terminations, changing load conditions
due to different spacing and count of daughter cards, and various frequencies,
as well as the benefit of source-synchronous clock over system-synchronous
clock operations. The backplane also can be used to observe the advantages
of edge-rate control and TI-OPC overshoot-protection circuitry, and show
the performance of TI GTLP devices vs alternate-source devices under
different loading conditions.
Topic Page
1.1 GTLP EVM Overview 7–310. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 GTLP EVM Kit Contents 7–311. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 GTLP EVM Kit Availability 7–312. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 1