Datasheet

SCEA017
7–288 GTLP in BTL Applications
Device Characteristics
• V
CC
– FB+ uses 5-V V
CC
, whereas GTLP uses 3.3-V V
CC
. The lower V
CC
is more
compatible with newer, higher-performance devices being used in current and future board
designs.
• Technology – FB+ uses an older 0.8-m bipolar process, whereas GTLP uses a newer 0.65-m
CMOS process that has the main advantage of lower power consumption.
• I
CC
– I
CC
is the amount of current used by the device and is a factor in computing power
consumption. CMOS construction reduces GTLP device I
CC
to about one-third of FB+ levels.
• Power consumption – Several factors influence power consumption: V
CC
, I
CC
, frequency of
operation, number of outputs switching, load capacitance, number of TTL-level inputs,
junction temperature, ambient temperature, and thermal resistance. GTLP power
consumption and overall heat dissipated is about one-half of FB+ levels.
• Propagation delay – The A-to-B and B-to-A propagation delays are larger in the GTLP
devices due to the slower edge slew rate and the slower CMOS process. High-drive GTLP
devices have the option of a smaller t
pd
by increasing the slew rate through the use of the
edge-rate-control (ERC) circuitry. The ERC pin controls slew rate.
• Logic functions – GTLP devices are available in several different functions and package
options (see Table 2). FB+ is available in several different functions (see Table 3).
– Most FB+ devices have split input (AI) and output (AO) buses on the A port, something
only the GTLP1394, GTLP1395, and GTLP2033/34 in the GTLP family have. Please
contact the GTLP team at [e-mail] if you would like a GTLP replacement for your
existing FB+ application.
– The FB1650 emulates the FB2031 and the FB2040.
– The FB2033A is slightly faster than the FB2033K (custom device released to the general
market).