Datasheet
SCEA022
7–280
Achieving Maximum Speed on Parallel Buses With Gunning Transceiver Logic (GTLP)
7 Bibliography
Electronic Industries Alliance
Definition of Skew Specifications for Standard Logic Devices
, EIA/JESD65, September 1998.
Interference Control Technologies, Inc.
Donald R. J. White,
EMI Control in the Design of Printed Circuit Boards and Backplanes
.
Texas Instruments Incorporated
G. Becke, E. Haseloff,
Das TTL-Kochbuch (The TTL Cookbook)
, SDYZG17.
PCB Design Guidelines for Reduced EMI
, Application Report, November 1999, SZZA009.
AVC Logic Family Technology and Applications
, August 1998, SCEA006A.
Comparison of Electrical and Thermal Parameters of Widebus
SMD SSOP, TSSOP,
TVSOP, and LFBGA Packages
, October 1999, SCYA007.
Metastable Response in Digital Circuits
, April 1995, SCBD002C.
Logic Selection Guide and Databook
, CD-ROM, April 1998, SCBC001B.
Design Considerations for Logic Products
, Application Book, [Volume 1], 1997, SDYA002.
Design Considerations for Logic Products
, Application Book, Volume 2, September 1999,
SDYA018.
Design Considerations for Logic Products
, Application Book, Volume 3, December 2000,
SDYA019.
Digital Design Seminar Reference Manual
, 1998, SDYDE01B.
What a Designer Should Know
, November 1994, SDZAE03.
The Bergeron Method
, Application Report, October 1996, SDYA014.
Bus-Interface Devices With Output-Damping Resistors or Reduced-Drive Outputs
,
Application Report, August 1997, SCBA012A.
Live Insertion
, Application Report, October 1996, SDYA012.
Thin Very Small-Outline Package
(
TVSOP)
, Application Report, May 2001, SCBA009.