Datasheet

7–213
A New Generation of BTL/Futurebus Transceivers
In response to the need for single-sided surface mounting and simplified transceiver architectures, Texas Instruments has
developed both a high-power package and a series of 18-channel BTL/Futurebus universal bus transceivers (UBT). These new
devices, designated as the FB16xx series, are packaged in a high-power version of the EIAJ standard 100-pin TQFP package
(0.5-mm lead pitch). A package cross section, as shown in Figure 5, reveals a metal heatsink that facilitates the excellent thermal
performance of the package. Refer to Thermal Characteristics of SLL Packages and Devices, literature number SCZA005, for
θ
JA
and reliability issues.
Heatsink
Die
Figure 5. Cross Section of Thermally Enhanced EIAJ 100-Pin TQFP
The FB16xx series devices are designed with both the universal data-storage capabilities of the FB2031 address/data transceiver
and the separate TTL I/O of the FB2040 control transceiver. This series of devices can be configured as two independent
9-channel transceivers (see Figure 6) or one coherent 18-channel transceiver.