Datasheet
7–132
FB Family
The Futurebus (FB)-series devices are used for high-speed bus applications and are fully compatible with the
IEEE 1194.1-1991 (BTL) standard. These transceivers are available in 7-, 8-, 9-, and 18-bit versions with TTL and BTL
translation in less than 5-ns performance. Other features include drive up to 100 mA and bias pins for
live-insertion applications.
GTL Family
GTL technology is a new reduced-voltage switching standard that provides high-speed, point-to-point communications, with
low power dissipation. TI offers GTL/TTL translators to interface with the TTL-based subsystems. Designers use the
GTL-switching standards for speed-sensitive subsystems, and use the translators to interface with the rest of the system. GTL
devices feature innovative circuitry, such as bus hold on the TTL inputs, to eliminate the need for external pullup resistors for
floating inputs, which reduces power, cost, and board-layout time. Output edge-rate control (OEC) is offered on the outputs
to reduce electromagnetic interference (EMI) caused by the high frequencies of GTL. Industry-leading packaging, such as
SSOP and TSSOP, is available for higher performance and reduced board space.
LV Family
TI’s LV CMOS technology products are specially-designed parts for 3-V power supply use with the same 5-V performance
characteristics of HCMOS logic. The LV family is a 2-µ CMOS process that provides up to 8 mA of drive, and propagation
delays of 18 ns maximum, while having a static power consumption of only 20 µA for both bus-interface and gate
functions.The LV family is available in the octal footprint with advanced packaging, such as small-outline integrated circuit
(SOIC), SSOP, and TSSOP.
LVC Family
TI’s LVC logic products are specially designed parts for 3-V power supply use, with about the same performance as the 5-V
74F family. The LVC family is a high-performance version with 0.8-µ CMOS process technology, 24-mA current drive, and
6.5-ns maximum propagation delays for driver operations. The LVC family includes both bus-interface and gate functions,
with 50 different functions planned.The LVC family is available in the octal and Widebus footprints with advanced
packaging, such as SOIC, SSOP, and TSSOP. Many LVC devices are available with 5-V tolerant inputs and outputs.
LVT Family
The specially designed 3-V LVT family uses the latest 0.8-µ BiCMOS process technology for bus-interface functions. Like
its 5-V ABT counterpart, LVT provides up to 64 mA of drive, 4-ns propagation delays, and in addition, consumes less than
100 µA of standby power. The bus-hold feature eliminates external pullup resistors and I/Os that can handle up to 7 V, which
allows them to act as 5-V/3-V translators.The LVT family is available in octal and Widebus footprints with advanced
packaging, such as SOIC, SSOP, and TSSOP.
LVTZ Family
The LVTZ family offers all of the features found in TI’s standard LVT family. In addition, LVTZ incorporates circuitry to
protect the devices in live-insertion applications. The device goes to the high-impedance state during power up and power
down, which is called power-up 3-state (PU3S). The LVTZ family is available in the octal footprint with advanced packaging,
such as SOIC, SSOP, and TSSOP.