Datasheet
SCEA019 - January 2001
7–98 Texas Instruments GTLP Frequently Asked Questions
16 What GTLP devices are available and how much will they cost?
The first wave of TI’s GTLP devices comprises seven medium-drive and six high-drive
devices. They are offered in ultra compact (LFBGA/VFBGA), small (TVSOP), medium
(TSSOP), or large (SOIC or SSOP) packages. Pricing is two to three times higher than
standard LVTTL/TTL backplane drivers, but GTLP devices allow two to four times higher
maximum backplane frequencies, providing higher data throughput without migrating to more
complex serial devices. Because signal integrity is superior in distributed loads, it also makes
sense to use GTLP in low-frequency applications where the noise margin using HC, ABT, or
LVT is not acceptable because of the weaker drive and poorer signal integrity. GTLP pricing is
the same or less than TI’s current GTL pricing (see Table 3).
Obtain the data sheet at www.ti.com/sc/gtlp. Go to www.ti.com/sc/package for package
drawings, symbolization, layout, and thermal-performance information.
Table 3. GTLP Family Offerings
SN74GTLP Function Bits
Pin Count
SOIC
SSOP
TSSOP
TVSOP
BGA
Suggested
Resale Price
(1000 Quantity)
Medium Drive (50 mA)
H306 Bus Transceiver 8 24 DW PW DGV $4.65
817 1:6 Fanout Driver NA 24 DW PW DGV $5.40
H16612 Universal Bus Transceiver 18 56 DL DGG $7.35
H16912 Universal Bus Transceiver 18 56 DGG DGV $7.90
H16916 UBT with Buffered Clock 17 56 DGG DGV $7.90
H16945 Bus Transceiver 2 x 8 48 DGG DGV GQL $5.00
H32945 Bus Transceiver 4 x 8 96 GKE $10.50
High Drive (100 mA)
1394 Transceiver 2 16 D PW DGV $3.75
H1612 Universal Bus Transceiver 18 64 DGG $9.15
H1616 UBT with Buffered Clock 17 64 DGG $9.15
H1645 Bus Transceiver 2 x 8 56 DGG DGV GQL $5.85
H1655 Universal Bus Transceiver 2 x 8 64 DGG $9.15
H3245 Bus Transceiver 4 x 8 114 GKF $12.25
Relevant package application information is contained in the following reports:
Thin Very Small-Outline Package (TVSOP) application report, literature number SCBA009C.
32-Bit Logic Families in LFBGA Packages 96 and 114 Ball Low-Profile Fine-Pitch BGA
Packages application report, literature number SCEA014.
Comparison of Electrical and Thermal Parameters of Widebus SMD and LFBGA Packages
application report, literature number SCYA007.