Datasheet
THERMAL INFORMATION
1–14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
In digital-system design, consideration must be given to thermal management of components. The small size of the
small-outline packages makes this even more critical. Figures 1–5 show the high-effect (High-K) thermal resistance
for the small-outline 14-, 16-, 20-, 24-, and 48-pin packages for various rates of airflow calculated in accordance with
JESD 51-7.
The thermal resistances in Figures 1–5 can be used to approximate typical and maximum virtual junction
temperatures. In general, the junction temperature for any device can be calculated using the following equation:
T
J
+ R
qJA
P
T
) T
A
where:
T
J
= virtual junction temperature (°C)
R
θJA
= thermal resistance, junction to free air (°C/W)
P
T
= total power dissipation of the device (W)
T
A
= free-air temperature (°C)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0 100 200 300 400 500
– Junction-to-Ambient Thermal Resistance –
θ
R
JA
C/W
°
JUNCTION-TO-AMBIENT THERMAL RESISTANCE
vs
AIR VELOCITY
D
DB
DGV
PW
14-Pin Packages
Air Velocity – ft/min
Figure 1