Datasheet

SN74GTLP1395
TWO 1-BIT LVTTL-TO-GTLP ADJUSTABLE-EDGE-RATE BUS TRANSCEIVERS
WITH SPLIT LVTTL PORT, FEEDBACK PATH, AND SELECTABLE POLARITY
SCES349B JUNE 2001 REVISED AUGUST 2001
3–38
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
description (continued)
This device is fully specified for live-insertion applications using I
off
, power-up 3-state, and BIAS V
CC
. The I
off
circuitry disables the outputs, preventing damaging current backflow through the device when it is powered
down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power
down, which prevents driver conflict. The BIAS V
CC
circuitry precharges and preconditions the B-port
input/output connections, preventing disturbance of active data on the backplane during card insertion or
removal, and permits true live-insertion capability.
This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly
terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This
improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies.
High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC
input voltage between low and high adjusts the B-port output rise and fall times. This allows the designer to
optimize system data-transfer rate and signal integrity to the backplane load.
When V
CC
is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, the output-enable (OE
) input should be tied to V
CC
through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of
the driver.
terminal assignments
1234
A 1T/C 1Y 1OEBY 2T/C
B GND GND 2Y 2OEBY
C V
CC
1OEAB ERC 1B
D GNE GND 1A 2B
E 2OEAB 2A BIAS V
CC
V
REF
ORDERING INFORMATION
T
A
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
Tube SN74GTLP1395DW
SOIC – DW
Tape and reel SN74GTLP1395DWR
GTLP1395
–40°C to 85°C
TSSOP – PW Tape and reel SN74GTLP1395PWR GP395
TVSOP – DGV Tape and reel SN74GTLP1395DGVR GP395
VFBGA – GQN Tape and reel SN74GTLP1395GQNR GP395
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
PRODUCT PREVIEW
GQN PACKAGE
(TOP VIEW)
1234
A
B
C
D
E