Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
85511012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 85511012A
SNJ54F
245FK
8551101RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8551101RA
SNJ54F245J
8551101SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8551101SA
SNJ54F245W
JM38510/34803B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
34803B2A
JM38510/34803BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
34803BRA
JM38510/34803BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
34803BSA
M38510/34803B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
34803B2A
M38510/34803BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
34803BRA
M38510/34803BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
34803BSA
SN54F245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54F245J
SN74F245DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI 0 to 70
SN74F245DBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 F245
SN74F245DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 F245
SN74F245DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 F245
SN74F245DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 F245
SN74F245DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 F245
SN74F245DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 F245