Datasheet


   
      
SCDS132A − SEPTEMBER 2003 − REVISED OCTOBER 2003
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
This device is fully specified for partial-power-down applications using I
off
. The I
off
feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE
should be tied to V
CC
through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
T
A
PACKAGE
†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOIC − DW
Tube SN74CBT3384CDW
CBT3384C
SOIC − DW
Tape and reel SN74CBT3384CDWR
CBT3384C
SSOP − DB
Tube SN74CBT3384CDB
CBT3384C
−40°C to 85°C
SSOP − DB
Tape and reel SN74CBT3384CDBR
CBT3384C
−40
°
C to 85
°
C
SSOP (QSOP) − DBQ Tape and reel SN74CBT3384CDBQR CBT3384C
TSSOP − PW
Tube SN74CBT3384CPW
CU384C
TSSOP − PW
Tape and reel SN74CBT3384CPWR
CU384C
TVSOP − DGV Tape and reel SN74CBT3384CDGVR CU384C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
FUNCTION TABLE
(each 5-bit bus switch)
INPUT
INPUT/OUTPUT
FUNCTION
INPUT
OE
INPUT/OUTPUT
A
FUNCTION
L B A port = B port
H Z Disconnect