Datasheet

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SN74BCT756

OCTAL BUFFER/DRIVER

WITH OPEN-COLLECTOR OUTPUTS

SCBS056B – OCTOBER 1990 – REVISED JULY 1997

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

BiCMOS Design Significantly Reduces I

CCZ

ESD Protection Exceeds 2000 V Per

MIL-STD-883, Method 3015; Exceeds 200 V

Using Machine Model (C = 200 pF, R = 0)

Open-Collector Outputs Drive Bus Lines or

Buffer Memory Address Registers

Package Options Include Plastic

Small-Outline Packages (DW) and Standard

Plastic 300-mil DIPs (N)

description

This octal buffer and line driver is designed

specifically to improve both the performance and

density of 3-state memory address drivers, clock

drivers, and bus-oriented receivers and

transmitters. The SN74BCT756, SN74BCT757,

and SN74BCT760 provide the choice of selected

combinations of inverting outputs, symmetrical

output-enable (OE

) inputs, and complementary

OE and OE inputs.

The SN74BCT756 is characterized for operation

from 0°C to 70°C.

FUNCTION TABLE

INPUTS

OUTPUT

OE A

H X H

L LH

L H L

logic symbol

†

1A1

1A2

1A3

1A4

1Y1

1Y2

1Y3

1Y4

2A1

2A2

2A3

2A4

2Y1

2Y2

2Y3

2Y4

1OE 2OE

†

This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

1OE

1A1

2Y4

1A2

2Y3

1A3

2Y2

1A4

2Y1

GND

2OE

1Y1

2A4

1Y2

2A3

1Y3

2A2

1Y4

2A1

DW OR N PACKAGE

(TOP VIEW)

Summary of content (11 pages)

PAGE 1
SN74BCT756 OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS SCBS056B – OCTOBER 1990 – REVISED JULY 1997 D D DW OR N PACKAGE (TOP VIEW) BiCMOS Design Significantly Reduces ICCZ ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Open-Collector Outputs Drive Bus Lines or Buffer Memory Address Registers Package Options Include Plastic Small-Outline Packages (DW) and Standard Plastic 300-mil DIPs (N) D D 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND d
PAGE 2
SN74BCT756 OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS SCBS056B – OCTOBER 1990 – REVISED JULY 1997 logic diagram (positive logic) 1OE 1A1 1A2 1A3 1A4 1 2OE 18 2 16 4 14 6 12 8 1Y1 1Y2 1Y3 1Y4 2A1 2A2 2A3 19 9 11 7 13 5 15 3 17 2A4 2Y1 2Y2 2Y3 2Y4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAGE 3
SN74BCT756 OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS SCBS056B – OCTOBER 1990 – REVISED JULY 1997 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK IOH VCC = 4.5 V, VCC = 4.5 V, II = –18 mA VOH = 5.5 V VOL II VCC = 4.5 V, VCC = 5.5 V, IOL = 64 mA VI = 7 V IIH IIL VCC = 5.5 V, VCC = 5.5 V, VI = 2.7 V VI = 0.5 V ICC VCC = 5.5 V, Outputs open Ci Co VCC = 5 V, VCC = 5 V, MIN TYP† 0.42 MAX UNIT –1.
PAGE 4
SN74BCT756 OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS SCBS056B – OCTOBER 1990 – REVISED JULY 1997 PARAMETER MEASUREMENT INFORMATION 7V (tPZL, tPLZ, O.C.) S1 Open (all others) R1 Test Point From Output Under Test CL (see Note A) R2 RL = R1 = R2 LOAD CIRCUIT 3V 1.5 V Timing Input 0V 1.5 V tw 3V 1.5 V 1.5 V 0V 3V Low-Level Pulse 1.5 V VOLTAGE WAVEFORMS PULSE DURATION 3V 1.5 V 1.5 V 0V 1.5 V 1.5 V VOL Out-of-Phase Output tPLZ 3.5 V 1.5 V tPHZ tPZH VOH 1.5 V 1.
PAGE 5
PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74BCT756DWR Package Package Pins Type Drawing SOIC DW 20 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 10.8 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 13.0 2.7 12.0 24.
PAGE 7
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74BCT756DWR SOIC DW 20 2000 367.0 367.0 45.
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