Datasheet

PACKAGE OPTION ADDENDUM

www.ti.com

18-Oct-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

74AVCH4T245DGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 WS245

74AVCH4T245DGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 WS245

74AVCH4T245PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 WS245

74AVCH4T245PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 WS245

74AVCH4T245PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 WS245

74AVCH4T245PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 WS245

74AVCH4T245RGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 WS245

74AVCH4T245RSVRG4 ACTIVE UQFN RSV 16 3000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 ZWV

SN74AVCH4T245D ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br)