Datasheet

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SN74AUP3G04

SCES762C –DECEMBER 2009– REVISED APRIL 2011

www.ti.com

The SN74AUP3G04 performs the Boolean function Y = A in positive logic.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

This device is fully specified for partial-power-down applications using I

off

. The I

off

circuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

(1)

ORDERABLE TOP-SIDE

PACKAGE

(2)

PART NUMBER MARKING

(3)

NanoStar™ – WCSP (DSBGA)

Reel of 3000 SN74AUP3G04YFPR _ _ _ H C _

0.23-mm Large Bump – YFP (Pb-free)

uQFN – DQE Reel of 5000 SN74AUP3G04DQER T9

–40°C to 85°C

QFN – RSE Reel of 5000 SN74AUP3G04RSER T9

SSOP – DCU Reel of 3000 SN74AUP3G04DCUR H04_

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3) DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.

YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

FUNCTION TABLE

INPUT OUTPUT

A Y

H L

L H

LOGIC DIAGRAM (POSITIVE LOGIC)

(1) Pin numbers shown are for the DCU and DQE packages.