Datasheet

1
2
7
1A
1B
1Y
5
6
3
2A
2B
2Y
SN74AUP2G32
SCES754B –SEPTEMBER 2009–REVISED MAY 2010 www.ti.com
The SN74AUP2G32 performs the Boolean function Y = A + B or Y = A\ • B\ in positive logic.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoStar™ – WCSP (DSBGA)
Reel of 3000 SN74AUP2G32YFPR _ _ _ H G _
0.23-mm Large Bump – YFP (Pb-free)
uQFN – DQE Reel of 5000 SN74AUP2G32DQER PS
–40°C to 85°C
QFN – RSE Reel of 5000 SN74AUP2G32RSER PS
SSOP – DCU Reel of 3000 SN74AUP2G32DCUR H32_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
(EACH GATE)
INPUTS
OUTPUT
Y
A B
H X H
X H H
L L L
LOGIC DIAGRAM (POSITIVE LOGIC)
Pin numbers shown are for DCU and DQE packages.
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Product Folder Link(s): SN74AUP2G32