Datasheet

DCU PACKAGE
(TOP VIEW)
1
8
2
7
3 6
1OE
1A
2Y
GND
4
5
V
CC
2OE
1Y
2A
RSE PACKAGE
(TOP VIEW)
1
7
2
6
8
3
5
4
V
CC
2OE
1Y
2A
GND
1OE
1A
2Y
DQE PACKAGE
(TOP VIEW)
1
8
2
7
3 6
1OE
1A
2Y
GND
4
5
V
CC
2OE
1Y
2A
1OE
1A
GND
2Y
V
CC
2OE
1Y
2A
YFP PACKAGE
(TOP VIEW)
4
5
3
6
2 7
1
8
A1 A2
B1 B2
C1 C2
D1 D2
(A)
Single, dual, and triple gates
Static-Power Consumption
(
µA)
AUP
AUP
3.3-V
Logic
(A)
0%
20%
40%
60%
80%
100%
Dynamic-Power Consumption
(
pF)
AUP
AUP
3.3-V
Logic
(A)
0%
20%
40%
60%
80%
100%
Switching Characteristics
at 25 MHz
(A)
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 5
10 15
20
25
30
35 40 45
Time (ns)
Voltage (V)
OutputInput
(A)
SN74AUP2Gxx data at C = 15 pF.
L
SN74AUP2G240
www.ti.com
SCES760B DECEMBER 2009REVISED MARCH 2010
LOW-POWER DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
Check for Samples: SN74AUP2G240
1
FEATURES
Available in the Texas Instruments NanoStar™ Optimized for 3.3-V Operation
Package
3.6-V I/O Tolerant to Support Mixed-Mode
Low Static-Power Consumption Signal Operation
(I
CC
= 0.9 mA Maximum)
t
pd
= 4.7 ns Maximum at 3.3 V
Low Dynamic-Power Consumption
Suitable for Point-to-Point Applications
(C
pd
= 4.2 pF Typ at 3.3 V)
Latch-Up Performance Exceeds 100 mA Per
Low Input Capacitance (C
i
= 1.5 pF Typical)
JESD 78, Class II
Low Noise – Overshoot and Undershoot
ESD Performance Tested Per JESD 22
<10% of V
CC
2000-V Human-Body Model
I
off
Supports Partial-Power-Down Mode
(A114-B, Class II)
Operation
1000-V Charged-Device Model (C101)
Wide Operating V
CC
Range of 0.8 V to 3.6 V
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable
applications. This family ensures a very low static- and dynamic-power consumption across the entire V
CC
range
of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal
integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
Figure 1. AUP – The Lowest-Power Family Figure 2. Excellent Signal Integrity
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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