Datasheet

1A 1Y
1 6
2A 2Y
3 4
SN74AUP2G17
SCES750A –SEPTEMBER 2009–REVISED MAY 2010 www.ti.com
The SN74AUP2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two
independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going
(V
T+
) and negative-going (V
T–
) signals.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1) (2)
T
A
PACKAGE ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoStar™ – WCSP (DSBGA)
Reel of 3000 SN74AUP2G17YFPR _ _ _ H 7 _
0.23-mm Large Bump – YFP (Pb-free)
QFN – DSF Reel of 5000 SN74AUP2G17DSFR HL
–40°C to 85°C
uQFN – DRY Reel of 5000 SN74AUP2G17DRYR HL
SOT (SC-70) – DCK Reel of 3000 SN74AUP2G17DCKR HL_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
(Each Inverter)
INPUT OUTPUT
A Y
H H
L L
LOGIC DIAGRAM (POSITIVE LOGIC)
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Product Folder Link(s): SN74AUP2G17