Datasheet

GND
DBV PACKAGE
(TOP VIEW)
5
1
V
CC
OE
2
A
3
4
Y
DRL PACKAGE
(TOP VIEW)
2
A
V
CC
5
1
OE
3
4
GNDGND
Y
DCK PACKAGE
(TOP VIEW)
2
A
3
4
GND
V
CC
5
OE
Y
1
DRY PACKAGE
(TOP VIEW)
A
N.C.
OE
6
5
4
2
3
GND
Y
V
CC
1
GND
Y
3
4
A
2
5
OE
6
1
N.C.
V
CC
DSF PACKAGE
(TOP VIEW)
YZP PACKAGE
(TOP VIEW)
YFP PACKAGE
( VIEW)TOP
GND
OE
Y
V
CC
A
3
5
2
1
4
A1
B1
C1
A2
C2
GND
OE
Y
V
CC
A
3
6
2
1
4
5
N.C.
A1
B1
C1
A2
B2
C2
SN74AUP1G126
www.ti.com SCES596F –JULY 2004–REVISED MAY 2010
LOW-POWER SINGLE BUS BUFFER GATE
WITH 3-STATE OUTPUT
Check for Samples: SN74AUP1G126
1
FEATURES
• Available in the Texas Instruments NanoStar™ • Input Hysteresis Allows Slow Input Transition
Package and Better Switching Noise Immunity at Input
• Low Static-Power Consumption • Wide Operating V
CC
Range of 0.8 V to 3.6 V
(I
CC
= 0.9 mA Max)
• Optimized for 3.3-V Operation
• Low Dynamic-Power Consumption
• 3.6-V I/O Tolerant to Support Mixed-Mode
(C
pd
= 4 pF Typ at 3.3 V)
Signal Operation
• Low Input Capacitance (C
i
= 1.5 pF Typ)
• t
pd
= 4.6 ns Max at 3.3 V
• Low Noise – Overshoot and Undershoot
• Suitable for Point-to-Point Applications
<10% of V
CC
• Latch-Up Performance Exceeds 100 mA Per
• Input-Disable Feature Allows Floating Input
JESD 78, Class II
Conditions
• ESD Performance Tested Per JESD 22−
• I
off
Supports Partial-Power-Down Mode
– 2000-V Human-Body Model
Operation
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
N.C. – No internal connection.
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable
applications. This family ensures a very low static and dynamic power consumption across the entire V
CC
range
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see
Figure 1 and Figure 2 ).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.