Datasheet

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TG
C
C
TG
C
C
TG
C
C
C
TG
C
C
CLR
CLK
D
PRE
Q
Q
C
6
2
7
3
5
1
SN74AUC1G74
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH CLEAR AND PRESET
SCES537D – DECEMBER 2003 – REVISED JUNE 2007
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74AUC1G74YZPR
0.23-mm Large Bump – YZP (Pb-free)
_ _ _UP_
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74AUC1G74YZTR
0.23-mm Large Bump – YZT (Pb-free)
–40 ° C to 85 ° C
QFN – RSE Reel of 3000 SN74AUC1G74RSER UP
SSOP – DCT Reel of 3000 SN74AUC1G74DCTR U74_ _ _
VSSOP – DCU Reel of 3000 SN74AUC1G74DCUR U74_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(3) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP/YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUTS OUTPUTS
PRE CLR CLK D Q Q
L H X X H L
X L X X L H
H H ↑ H H L
H H ↑ L L H
H H L X Q
0
Q
0
LOGIC DIAGRAM (POSITIVE LOGIC)
A. Pin numbers shown are for the DCT, DCU, YZP, and YZT packages only.
2
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