Datasheet

B
C
A
1
4
2
Absolute Maximum Ratings
(1)
SN74AUC1G66
SCES386L MARCH 2002 REVISED JULY 2009 ..........................................................................................................................................................
www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™
Reel of 3000 SN74AUC1G66YZPR _ _ _U6_
WCSP (DSBGA) YZP (Pb-free)
SON DRY Reel of 5000 SN74AUC1G66DRYR PREVIEW
40 ° C to 85 ° C
SOT (SOT-23) DBV Reel of 3000 SN74AUC1G66DBVR U66_
SOT (SC-70) DCK Reel of 3000 SN74AUC1G66DCKR U6_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(3) DBV/DCK/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
FUNCTION TABLE
CONTROL
INPUT SWITCH
(C)
L OFF
H ON
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range 0.5 3.6 V
V
I
Input voltage range
(2)
0.5 3.6 V
V
I/O
Switch I/O voltage range
(2) (3)
0.5 V
CC
+ 0.5 V
I
IK
Control input clamp current V
I
< 0 50 mA
I
IOK
I/O port diode current V
I/O
< 0 or V
I/O
> V
CC
± 50 mA
I
T
On-state switch current V
I/O
= 0 to V
CC
± 50 mA
Continuous current through V
CC
or GND ± 100 mA
DBV package 206
DCK package 252
θ
JA
Package thermal impedance
(4)
° C/W
DRY package 234
YZP package 123
T
stg
Storage temperature range 65 150 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operating
conditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
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