Datasheet
Absolute Maximum Ratings
(1)
SN74AUC1G32
SCES377O – SEPTEMBER 2001 – REVISED SEPTEMBER 2009 ...................................................................................................................................
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ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74AUC1G32YZPR _ _ _UG_
0.23-mm Large Bump – YZP (Pb-free)
SON – DRY Reel of 5000 SN74AUC1G32DRYR PREVIEW
– 40 ° C to 85 ° C
SOT (SOT-23) – DBV Reel of 3000 SN74AUC1G32DBVR U32_
SOT (SC-70) – DCK Reel of 3000 SN74AUC1G32DCKR UG_
SOT (SOT-553) – DRL Reel of 4000 SN74AUC1G32DRLR UG_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUT
Y
A B
H X H
X H H
L L L
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range – 0.5 3.6 V
V
I
Input voltage range
(2)
– 0.5 3.6 V
V
O
Voltage range applied to any output in the high impedance or power-off state
(2)
– 0.5 3.6 V
V
O
Output voltage range
(2)
– 0.5 V
CC
+ 0.5 V
I
IK
Input clamp current V
I
< 0 – 50 mA
I
OK
Output clamp current V
O
< 0 – 50 mA
I
O
Continuous output current ± 20 mA
Continuous current through V
CC
or GND ± 100 mA
DBV package 206
DCK package 252
θ
JA
Package thermal impedance
(3)
DRL package 142 ° C/W
DRY package 234
YZP package 132
T
stg
Storage temperature range – 65 150 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operating
conditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
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