Datasheet

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6
Y
0
4
Y
1
A
E
SN74AUC1G19
1-OF-2 DECODER/DEMULTIPLEXER
SCES626D – MARCH 2005 – REVISED APRIL 2007
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP Reel of 3000 SN74AUC1G19YZPR U5_
(Pb-free)
SON – DRY Reel of 5000 SN74AUC1G19DRYR PREVIEW
Reel of 3000 SN74AUC1G19DBVR U19_
–40 ° C to 85 ° C
SOT (SOT-23) – DBV
Reel of 250 SN74AUC1G19DBVT U19_
Reel of 3000 SN74AUC1G19DCKR
SOT (SC-70) – DCK U5_
Reel of 250 SN74AUC1G19DCKT
SOT (SOT-553) – DRL Reel of 4000 SN74AUC1G19DRLR U5_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(3) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUTS OUTPUTS
E A Y
0
Y
1
L L L H
L H H L
H X H H
LOGIC DIAGRAM (POSITIVE LOGIC)
2
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