Datasheet
www.ti.com
A Y
2 4
Absolute Maximum Ratings
(1)
SN74AUC1G04
SINGLE INVERTER GATE
SCES370Q – SEPTEMBER 2001 – REVISED APRIL 2007
ORDERING INFORMATION
ORDERABLE PART
T
A
PACKAGE
(1) (2)
TOP-SIDE MARKING
(3)
NUMBER
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP Reel of 3000 SN74AUC1G04YZPR _ _ _UC_
(Pb-free)
SON – DRY Reel of 5000 SN74AUC1G04DRYR PREVIEW
–40 ° C to 85 ° C
SOT (SOT-23) – DBV Reel of 3000 SN74AUC1G04DBVR U04_
SOT (SC-70) – DCK Reel of 3000 SN74AUC1G04DCKR UC_
SOT (SOT-553) – DRL Reel of 4000 SN74AUC1G04DRLR UC_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the
TI website at www.ti.com .
(3) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUT OUTPUT
A Y
H L
L H
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 3.6 V
V
I
Input voltage range
(2)
–0.5 3.6 V
Voltage range applied to any output in the high-impedance or power-off state
(2)
–0.5 3.6
V
O
V
Output voltage range
(2)
–0.5 V
CC
+ 0.5
I
IK
Input clamp current V
I
< 0 –50 mA
I
OK
Output clamp current V
O
< 0 –50 mA
I
O
Continuous output current ± 20 mA
Continuous current through V
CC
or GND ± 100 mA
DBV package 206
DCK package 252
θ
JA
Package thermal impedance
(3)
DRL package 142 ° C/W
DRY package 234
YZP package 132
T
stg
Storage temperature range –65 150 ° C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
2
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