Datasheet

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

5962-87767012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-

87767012A

SNJ54AS

760FK

5962-8776701RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8776701RA

SNJ54AS760J

SN74ALS760DW ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS760

SN74ALS760DWE4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS760

SN74ALS760DWG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS760

SN74ALS760DWR OBSOLETE SOIC DW 20 TBD Call TI Call TI 0 to 70 ALS760

SN74ALS760DWRE4 OBSOLETE SOIC DW 20 TBD Call TI Call TI 0 to 70

SN74ALS760DWRG4 OBSOLETE SOIC DW 20 TBD Call TI Call TI 0 to 70

SN74ALS760N ACTIVE PDIP N 20 20 Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 SN74ALS760N

SN74ALS760NE4 ACTIVE PDIP N 20 20 Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 SN74ALS760N

SN74AS760DW ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br)