Datasheet

DEVICE NAMES AND PACKAGE DESIGNATORS
1–12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN 74 ALVC 16
H 244 DGG2
123456789
Example:
R
10
1
2
3
4
5
6
7
8
9
Standard Prefix
Temperature Range
Family
Special Features
Bit Width
Options
Function
Device Revision
Packages
Examples: Blank – Transistor-Transistor Logic
ABT – Advanced BiCMOS Technology
ABTE – Advanced BiCMOS Technology/
Enhanced Transceiver Logic
AC/ACT – Advanced CMOS Logic
AHC/AHCT – Advanced High-Speed CMOS Logic
ALB – Advanced Low-Voltage BiCMOS
ALS – Advanced Low-Power Schottky Logic
ALVC – Advanced Low-Voltage CMOS Technology
AS – Advanced Schottky Logic
AVC – Advanced Very Low-Voltage CMOS Logic
BCT – BiCMOS Bus-Interface Technology
CBT – Crossbar Technology
CBTLV – Low-Voltage Crossbar Technology
F – F Logic
FB – Backplane Transceiver Logic/Futurebus+
GTL – Gunning Transceiver Logic
HC/HCT – High-Speed CMOS Logic
HSTL – High-Speed Transceiver Logic
LS – Low-Power Schottky Logic
LV – Low-Voltage CMOS Technology
LVC – Low-Voltage CMOS Technology
LVT – Low-Voltage BiCMOS Technology
S – Schottky Logic
SSTL – Stub Series-Terminated Logic
TVC – Translation Voltage Clamp Logic
Examples: Blank = No Special Features
D – Level-Shifting Diode (CBTD)
H – Bus Hold (ALVCH)
R – Damping Resistor on Inputs/Outputs (LVCR)
S – Schottky Clamping Diode (CBTS)
Examples: Blank = Gates, MSI, and Octals
1G – Single Gate
8 – Octal IEEE 1149.1 (JTAG)
16 – Widebus (16, 18, and 20 bit)
18 – Widebus IEEE 1149.1 (JTAG)
32 – Widebus+ (32 and 36 bit)
Examples: Blank = No Options
2 – Series-Damping Resistor on Outputs
4 – Level Shifter
25 – 25-Ω Line Driver
Examples: 244 – Noninverting Buffer/Driver
374 – D-Type Flip-Flop
573 – D-Type Transparent Latch
640 – Inverting Transceiver
Examples: Blank = No Revision
Letter Designator A–Z
Examples: D, DW – Small-Outline Integrated Circuit (SOIC)
DB, DL – Shrink Small-Outline Package (SSOP)
DBB, DGV – Thin Very Small-Outline Package (TVSOP)
DBQ – Quarter-Size Outline Package (QSOP)
DBV, DCK – Small-Outline Transistor Package (SOT)
DGG, PW – Thin Shrink Small-Outline Package (TSSOP)
FK – Leadless Ceramic Chip Carrier (LCCC)*
FN – Plastic Leaded Chip Carrier (PLCC)
GB – Ceramic Pin Grid Array (CPGA)*
GKE, GKF – MicroStar BGA Low-Profile Fine-Pitch
Ball Grid Array (LFBGA)
HFP, HS, HT, HV – Ceramic Quad Flatpack (CQFP)*
J, JT – Ceramic Dual-In-Line Package (CDIP)*
N, NP, NT – Plastic Dual-In-Line Package (PDIP)
NS, PS – Small-Outline Package (SOP)
PAG, PAH, PCA, PCB, PM, PN, PZ – Thin Quad Flatpack
(TQFP) or Thin Shrink Small-Outline Package (TSSOP)
PH, PQ, RC – Quad Flatpack (QFP)
W, WA, WD – Ceramic Flatpack (CFP)*
* Military Only
10 Tape and Reel
Examples:
Existing Nomenclature – SN74LVTxxxDBLE
New Nomenclature – SN74LVTxxxADBR
Example: SNJ – Conforms to MIL-PRF-38535 (QML)
Examples: 54 – Military
74 – Commercial
Devices in the DB and PW package types include the R designation
for reeled product. Existing products designated as LE may maintain
that designation, but are being converted to R.
There is no functional difference between LE and R designated
products, with respect to the carrier tape, cover tape, or reels used.
LE – Left Embossed (valid for DB and PW packages only)
R – Standard (valid for all surface-mount packages
except some DB and PW devices)
MicroStar BGA, Widebus, and Widebus+ are trademarks of Texas Instruments Incorporated.