Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-89526013A ACTIVE LCCC FK 28 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
89526013A
SNJ54AS
869FK
5962-8952601KA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8952601KA
SNJ54AS869W
5962-8952601LA ACTIVE CDIP JT 24 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8952601LA
SNJ54AS869JT
5962-89668013A ACTIVE LCCC FK 28 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
89668013A
SNJ54AS
867FK
5962-8966801KA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8966801KA
SNJ54AS867W
5962-8966801LA ACTIVE CDIP JT 24 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8966801LA
SNJ54AS867JT
SN54AS867JT ACTIVE CDIP JT 24 1 TBD A42 N / A for Pkg Type -55 to 125 SN54AS867JT
SN54AS869JT ACTIVE CDIP JT 24 1 TBD A42 N / A for Pkg Type -55 to 125 SN54AS869JT
SN74ALS867ADW ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS867A
SN74ALS867ADWE4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS867A
SN74ALS867ADWG4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS867A
SN74ALS867ANT ACTIVE PDIP NT 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 SN74ALS867ANT
SN74ALS867ANTE4 ACTIVE PDIP NT 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type 0 to 70 SN74ALS867ANT
SN74ALS869DW ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS869
SN74ALS869DWE4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS869
SN74ALS869DWG4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS869