Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
84012012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84012012A
SNJ54ALS
573CFK
8401201RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8401201RA
SNJ54ALS573CJ
8401201SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8401201SA
SNJ54ALS573CW
JM38510/38201B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
38201B2A
JM38510/38201BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
38201BRA
M38510/38201B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
38201B2A
M38510/38201BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
38201BRA
SN54ALS573CJ ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54ALS573CJ
SN54AS573AJ ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54AS573AJ
SN74ALS573CDBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI 0 to 70
SN74ALS573CDBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 G573C
SN74ALS573CDBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 G573C
SN74ALS573CDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 G573C
SN74ALS573CDW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS573C
SN74ALS573CDWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS573C
SN74ALS573CDWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS573C
SN74ALS573CDWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS573C