Datasheet

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
5962-9674601Q3A ACTIVE LCCC FK 28 1 TBD POST-PLATE N / A for Pkg Type
5962-9674601QKA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type
5962-9674601QLA ACTIVE CDIP JT 24 1 TBD A42 N / A for Pkg Type
SN74ABT853DBLE OBSOLETE SSOP DB 24 TBD Call TI Call TI
SN74ABT853DBRE4 ACTIVE SSOP DB 24 TBD Call TI Call TI
SN74ABT853DBRG4 ACTIVE SSOP DB 24 TBD Call TI Call TI
SN74ABT853DW ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ABT853DWE4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ABT853DWG4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ABT853DWR ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ABT853DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ABT853DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74ABT853NSRE4 ACTIVE SO NS 24 TBD Call TI Call TI
SN74ABT853NSRG4 ACTIVE SO NS 24 TBD Call TI Call TI
SN74ABT853NT ACTIVE PDIP NT 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74ABT853NTE4 ACTIVE PDIP NT 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74ABT853PWE4 ACTIVE TSSOP PW 24 TBD Call TI Call TI
SN74ABT853PWG4 ACTIVE TSSOP PW 24 TBD Call TI Call TI
SN74ABT853PWLE OBSOLETE TSSOP PW 24 TBD Call TI Call TI
SN74ABT853PWRE4 ACTIVE TSSOP PW 24 TBD Call TI Call TI
SN74ABT853PWRG4 ACTIVE TSSOP PW 24 TBD Call TI Call TI
SNJ54ABT853FK ACTIVE LCCC FK 28 1 TBD POST-PLATE N / A for Pkg Type
SNJ54ABT853JT ACTIVE CDIP JT 24 1 TBD A42 N / A for Pkg Type
SNJ54ABT853W ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 1