Datasheet

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RECOMMENDED OPERATING CONDITIONS (see Figure 1 )
THERMAL CHARACTERISTICS
DEVICE ELECTRICAL CHARACTERISTICS
SN65MLVD047
SLLS606A MARCH 2004 REVISED JULY 2005
MIN NOM MAX UNIT
V
CC
Supply voltage 3 3.3 3.6 V
V
IH
High-level input voltage 2 V
CC
V
V
IL
Low-level input voltage 0 0.8 V
Voltage at any bus terminal (separate or common mode) V
Y
or V
Z
–1.4 3.8 V
R
L
Differential load resistance 30 55
1/t
UI
Signaling rate 200 Mbps
Clock frequency 100 MHz
T
J
Junction temperature –40 125 ° C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Low-K board
(1)
, no airflow D 128
Low-K board
(1)
, no airflow 194.2
θ
JA
Junction-to-ambient thermal resistance Low-K board
(1)
, 150 LFM 146.8 ° C/W
PW
Low-K board
(1)
, 250 LFM 133.1
High-K board
(2)
, no airflow 121.6
D 51.1
θ
JB
Junction-to-board thermal resistance High-K board
(2)
° C/W
PW 85.3
D 45.4
θ
JC
Junction-to-case thermal resistance ° C/W
PW 34.7
EN = V
CC
, EN = GND, R
L
= 50 , Input 100 MHz 50 %
P
D
Device power dissipation 288.5 mW
duty cycle square wave to 1A:4A, T
A
= 85 ° C
(1) In accordance with the Low-K thermal metric difinitions of EIA/JESD51-3.
(2) In accordance with the High-K thermal metric difinitions of EIA/JESD51-7.
over recommended operating conditions unless otherwise noted
PARAMETER TEST CONDITIONS MIN
(1)
TYP
(2)
MAX UNIT
Driver enabled EN = V
CC
, EN = GND, R
L
= 50 , All inputs = V
CC
or GND 59 70
I
CC
Supply current mA
Driver disabled EN = GND, EN = V
CC
, R
L
= No load, All inputs = V
CC
or GND 2 4
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
(2) All typical values are at 25°C and with a 3.3-V supply voltage.
3