Datasheet

Schematic, Bill of Materials, and Board Layouts www.ti.com
6.3 Board Layouts
Table 4. SN65LVDS4EVM Printed-Circuit Board Layer Construction
Subclass Thickness Conductivity Dielectric Loss Width Impedance
Type Material Artwork
Name (mil) (mho/cm) Constant Tangent (mil) (Ω)
(1)
SURFACE AIR
MASK LPI
FINISH ENIG 1.29
TOP CONDUCTOR COPPER 0.689 595900 1 0 POSITIVE 10 50
DIELECTRIC FR-4 6 0 4.2 0.035
L2_GND PLANE COPPER 1.378 595900 1 0 POSITIVE
DIELECTRIC FR-4 10 0 4.2 0.035
L3_POWER CONDUCTOR COPPER 1.378 595900 1 0 POSITIVE
DIELECTRIC FR-4 6 0 4.2 0.035
BOTTOM CONDUCTOR COPPER 0.689 595900 1 0 POSITIVE N/A
FINISH ENIG 1.29
MASK LPI
SURFACE AIR
(1)
Always consult with your board manufacturer for their process/design requirements to ensure the desired impedance is
achieved.
Figure 3. SN65LVDS4EVM Board Layout, Top – Layer 1
6
SN65LVDS4 Evaluation Module SLLU151– July 2011
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