Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN65LVDS386DGGR TSSOP DGG 64 2000 367.0 367.0 45.0
SN65LVDS388ADBTR TSSOP DBT 38 2000 367.0 367.0 38.0
SN65LVDS390DR SOIC D 16 2500 367.0 367.0 38.0
SN65LVDS390PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN65LVDT386DGGR TSSOP DGG 64 2000 367.0 367.0 45.0
SN65LVDT388ADBTR TSSOP DBT 38 2000 367.0 367.0 38.0
SN65LVDT390PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN75LVDS390DR SOIC D 16 2500 367.0 367.0 38.0
SN75LVDS390PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN75LVDT386DGGR TSSOP DGG 64 2000 367.0 367.0 45.0
SN75LVDT388ADBTR TSSOP DBT 38 2000 367.0 367.0 38.0
SN75LVDT390DR SOIC D 16 2500 367.0 367.0 38.0
SN75LVDT390PWR TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Jul-2013
Pack Materials-Page 2