Datasheet

www.ti.com
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
7 V
300 kΩ
50 Ω
V
CC
Input
V
CC
5 Ω
7 V
Y or Z
Output
EQUIVALENT OF EACH A INPUT EQUIVALENT OF G, G, 1,2EN OR 3,4EN INPUTS TYPICAL OF ALL OUTPUTS
7 V
50 Ω
V
CC
Input
10 kΩ
ABSOLUTE MAXIMUM RATINGS
(1)
DISSIPATION RATING TABLE
SN55LVDS31, SN65LVDS31
SN65LVDS3487, SN65LVDS9638
SLLS261L – JULY 1997 – REVISED JULY 2007
over operating free-air temperature range (unless otherwise noted)
UNIT
V
CC
Supply voltage range
(2)
–0.5 V to 4 V
V
I
Input voltage range –0.5 V to V
CC
+ 0.5 V
Continuous total power dissipation See Dissipation Rating Table
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 ° C
T
stg
Storage temperature range –65 ° C to 150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages, except differential I/O bus voltages, are with respect to the network ground terminal.
T
A
≤ 25 ° C DERATING FACTOR
(1)
T
A
= 70 ° C T
A
= 85 ° C T
A
= 125 ° C
PACKAGE
POWER RATING ABOVE T
A
= 25 ° C POWER RATING POWER RATING POWER RATING
D (8) 725 mW 5.8 mW/ ° C 464 mW 377 mW —
D (16) 950 mW 7.6 mW/ ° C 608 mW 494 mW —
DGK 425 mW 3.4 mW/ ° C 272 mW 221 mW —
DGN
(2)
2.14 W 17.1 mW/ ° C 1.37 W 1.11 W —
FK 1375 mW 11.0 mW/ ° C 880 mW 715 mW 275 mW
J 1375 mW 11.0 mW/ ° C 880 mW 715 mW 275 mW
PW (16) 774 mW 6.2 mW/ ° C 496 mW 402 mW —
W 1000 mW 8.0 mW/ ° C 640 mW 520 mW 200 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
(2) The PowerPAD™ must be soldered to a thermal land on the printed-circuit board. See the application note PowerPAD Thermally
Enhanced Package (SLMA002 ).
5
Submit Documentation Feedback