Datasheet
SN65LVDS315
www.ti.com
SLLS881F –DECEMBER 2007–REVISED SEPTEMBER 2012
Table 5. Mode Transition Use Cases (continued)
MODE TRANSITION USE CASE TRANSITION SPECIFICS
Acquire -> Transmit Device is ready to transfer data 1. PLL is active and approaches lock
2. PLL achieves lock within t
wakeup
3. Parallel data input latches into shift register.
4. Data input patterns are monitored and the line counter is initialized
5. CLK output turns on
6. DOUT turns on and sends out first serial data bit.
Transmit -> Standby Request transmitter to enter 1. DCLK Input monitor detects missing DCLK.
standby mode by stopping DCLK
2. Transmitter indicates standby, putting all outputs into high-impedance
state.
3. PLL shuts down.
4. DCLK activity input monitor remains active.
Transmit/Standby -> Turn off transmitter by pulling 1. TXEN pulled low for > t
pwrdn
.
Shutdown TXEN low
2. Transmitter indicates standby by switching output CLK+ and CLK– into
high-impedance state.
3. Transmitter drives DOUT into high-impedance state.
4. Most IC circuitry is shut down for least power consumption.
ORDERING INFORMATION
PART NUMBER PACKAGE SHIPPING METHOD
SN65LVDS315RGER 24-Pin QFN 0,5 mm pitch Reel
ABSOLUTE MAXIMUM RATINGS
(1)
VALUE UNIT
VDDIO –0.3 to 4 V
Supply voltage range
(2)
VDDD, VDDA –0.3 to 2.175 V
Voltage range at any output terminal –0.5 to 2.175 V
Voltage range at any input terminal –0.5 to VDDIO + 0.5V V
Human Body Model
(3)
(All pins) ±3 kV
Electrostatic discharge Charged-Device Model
(4)
(All pins) ±500 V
Machine Model
(5)
(All pins) ±200 V
Continuous power dissipation See Dissipation Rating Table
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum- rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the GND terminals.
(3) In accordance with JEDEC Standard 22, Test Method A114-A.
(4) In accordance with JEDEC Standard 22, Test Method C101.
(5) In accordance with JEDEC Standard 22, Test Method A115-A
DISSIPATION RATINGS
DERATING FACTOR
(1)
T
A
= 85°C
CIRCUIT BOARD
PACKAGE T
A
≤ 25°C
MODEL
ABOVE T
A
= 25°C POWER RATING
RGE Low-K
(2)
536 mW 6.7 mW/°C 134 mW
RGE High-K 1.6 W 21.1 mW/°C >420 mW
(1) This is the inverse of the junction-to-ambient thermal resistance with the Low-K thermal metric definitions of EIA/JESD51–2 and with no
air flow..
(2) In accordance with the Low-K thermal metric definitions of EIA/JESD51–2.
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