Datasheet

Board Layout Patterns
3-4
Figure 3–5. Layer 3 Split V
CC
amd V
EE
Figure 3–6. Layer 4 GND Plane
Figure 3–7. PCB Fabrication Notes and Stackup
Single: Layer 1
GND: Layer 2
Split Power: Layer 3
GND: Layer 4
Stackup
0.006”
0.042”
0.006”
Notes: 1) PWB to be fabricated to meet or exceed IPC-6012, Class 3 standards and workmanship conform to IPC-A-600,
Class 3 current revisions
2) Board material and construction to be UL approved and marked on the finished board.
3) Laminate materal: Copper-clad NELCO N4000-13 (DO NOT USE—13SI)
4) Copper weight: 1 oz finished
5) Finished thickness: 0.62” ±0.10”
6) Minimum plating thickness in through holes: 0.001”
7) SMOBC/HASL
8) LPI soldermask both sides using appropriate layer
artwork: color = green
9) LPI silkscreen as required: color = white
10)LPI soldermask both sides using appropriate layer
artwork: color = green
11)Minimum copper conductor width is: 0.010”
Minimum conductor spacing is: 0.009”
12)Number of finished layers: 4
13)Top layer 10 mil traces to be 50-Ω impedance
14)Spacing between layers 3 and 4 should be 0.006”