Datasheet

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SLLS163E − JULY 1993 − REVISED APRIL 2006
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 10
I
O
− Output Current − mA
DIFFERENTIAL OUTPUT VOLTAGE
vs
OUTPUT CURRENT
3
2.5
2
1.5
1
0.5
90807060
5040302010
0
− Differential Output Voltage − V
0
OD
V
100
V
CC
= 5 V
T
A
= 25°C
Figure 11
t
pd(DO)
T
A
− Free-Air Temperature − °C
PROPAGATION DELAY TIME,
DIFFERENTIAL OUTPUT
vs
FREE-AIR TEMPERATURE
11
10
9
8
7
6
5
1008060
40200−20−40
4
12
Propagation Delay Time, Differential Output − ns
−60
13
14
R
L
= 54 Ω
C
L
= 50 pF
V
CC
= 5 V
−
THERMAL CHARACTERISTICS − DW PACKAGE
PARAMETER
TEST CONDITIONS MIN TYP MAX UNIT
Junction−to−ambient thermal reisistance, θ
JA
†
Low-K board, no air flow 96
Junction−to−ambient thermal reisistance, θ
JA
†
High-K board, no air flow 62.9
°C/W
Junction−to−board thermal reisistance, θ
JB
High-K board, no air flow 39.6
°C/W
Junction−to−case thermal reisistance, θ
JC
29.1
Average power dissipation, P
(AVG)
All four channels maximum loading,
maximum signaling rate, R
L
= 54 Ω, input to
D is 10 Mbps 50% duty cycle square wave,
V
CC
= 5.25 V, T
J
= 130 °C.
1100 mW
Ambient free−air temperature, T
A
JEDEC high-K board model −40 85
Ambient free−air temperature, T
A
JEDEC high-K board model −40 64
°C
Thermal shutdown junction temperature, T
SD
165
C
†
See TI application note literature number SZZA003, Package Thermal Characterization Methodologies, for an explanation of this parameter.