Datasheet
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
RECOMMENDED OPERATING CONDITIONS
SN65HVS880
SLAS592C – MARCH 2008 – REVISED NOVEMBER 2008 ...............................................................................................................................................
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over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V24 Field power input V24 – 0.3 35 V
V
IPx
Field digital inputs IPx – 0.3 35 V
V
ID
Voltage at any logic input DB0, DB1, CLK, SIP, CE, LD – 0.5 6 V
I
O
Output current CHOK, SOP ± 8 mA
All pins ± 4
Human-Body Model
(1)
kV
IPx,V24 ± 15
V
ESD
Electrostatic discharge
Charged-Device Model
(2)
All pins ± 1 kV
Machine Model
(3)
All pins ± 100 V
Continuous total power
P
TOT
See Thermal Characteristics table
dissipation
T
J
Junction temperature 170 ° C
(1) JEDEC Standard 22, Method A114-A.
(2) JEDEC Standard 22, Method C101
(3) JEDEC Standard 22, Method A115-A
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
θ
JA
Junction-to-air thermal resistance High-K thermal resistance 35 ° C/W
θ
JB
Junction-to-board thermal resistance 15 ° C/W
θ
JC
Junction-to-case thermal resistance 4.27 ° C/W
I
LOAD
= 50 mA, R
IN
= 0, IPO – IP7 = V24 = 30 V,
PD Device power dissipation RE7 = FGND, f
CLK
= 100 MHz, 2591 mW
I
IP-LIM
and I
CC
= worst case with R
LIM
= 25 k Ω
MIN TYP MAX UNIT
V
24
Field supply voltage 18 24 30 V
V
IPL
Field input low-state input voltage
(1)
0 6 V
V
IPH
Field input high-state input voltage
(1)
10 30 V
V
IL
Logic low-state input voltage 0 0.8 V
V
IH
Logic high-state input voltage 2 5.5 V
R
LIM
Current limiter resistor 17 25 500 k Ω
f
IP
Input data rate
(2)
0 1 Mbps
T
J
150 ° C
T
A
– 40 85 ° C
(1) Field input voltages correspond to an input resistor of R
IN
= 1.2 k Ω
(2) Maximum data rate corresponds to 0 ms debounce time, (DB0 = open, DB1 = FGND), and R
IN
= 0 Ω
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