Datasheet

www.ti.com
THERMAL CHARACTERISTICS
RECOMMENDED OPERATING CONDITIONS
SN65HVD251-Q1
SLLS788 – APRIL 2007
PARAMETER TEST CONDITIONS VALUE UNIT
MIN TYP MAX
θ
JB
Junction-to-board thermal resistance 78.7 ° C/W
θ
JC
Junction-to-case thermal resistance 44.6 ° C/W
V
CC
= 5 V, T
J
= 27 ° C, R
L
= 60 Ω ,
R
S
at 0 V, Input to D a 500-kHz 97.7 mW
50% duty cycle square wave
P
D
Device power dissipation
V
CC
= 5.5 V, T
J
= 130 ° C, R
L
= 60 Ω ,
R
S
at 0 V, Input to D a 500-kHz 50% 142 mW
duty cycle square wave
T
SD
Thermal shutdown junction temperature 165 ° C
over recommended operating conditions (unless otherwise noted)
PARAMETER MIN NOM MAX UNIT
Supply voltage, V
CC
4.5 5.5 V
Voltage at any bus terminal (separately or common mode) V
I
or V
IC
–7
(1)
12 V
High-level input voltage, V
IH
D input 0.7 V
CC
V
Low-level input voltage, V
IL
D input 0.3 V
CC
V
Differential input voltage, V
ID
–6 6 V
Input voltage to Rs, V
I(Rs)
0 V
CC
V
Input voltage at Rs for standby, V
I(Rs)
0.75 V
CC
V
CC
V
Rs wave-shaping resistance 0 100 k Ω
Driver –50
High-level output current, I
OH
mA
Receiver –4
Driver 50
Low-level output current, I
OL
mA
Receiver 4
Operating free-air temperature, T
A
–40 125 ° C
Junction temperature, T
j
145 ° C
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
3
Submit Documentation Feedback