Datasheet
SN65HVD233-HT
www.ti.com
SLLS933F –NOVEMBER 2008–REVISED AUGUST 2012
THERMAL CHARACTERISTICS FOR D PACKAGE
over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
θ
JC
Junction-to-case thermal resistance (to bottom of case) 49 °C/W
THERMAL CHARACTERISTICS FOR JD PACKAGE
over operating free-air temperature range unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Low-K
(2)
board, no air flow 83.4
Junction-to-ambient thermal
θ
JA
°C/W
resistance
(1)
High-K
(3)
board, no air flow 64.9
θ
JB
Junction-to-board thermal resistance High-K
(3)
board, no air flow 27.9 °C/W
θ
JC
Junction-to-case thermal resistance 6.49 °C/W
R
L
= 60 Ω, R
S
= 0 V, input to D a 1-MHz 50%
P
(AVG)
Average power dissipation duty 114 mW
cycle square wave, V
CC
= 3.3 V, T
A
= 25°C
(1) See TI literature number SZZA003 for an explanation of this parameter.
(2) JESD51-3 low effective thermal conductivity test board for leaded surface-mount packages.
(3) JESD51-7 high effective thermal conductivity test board for leaded surface-mount packages.
THERMAL CHARACTERISTICS FOR HKJ OR HKQ PACKAGE
over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
to ceramic side of case 5.7
θ
JC
Junction-to-case thermal resistance °C/W
to top of case lid (metal side of case) 13.7
RECOMMENDED OPERATING CONDITIONS
T
A
= –55°C to 210°C
UNIT
MIN MAX
V
CC
Supply voltage 3 3.6 V
Voltage at any bus terminal (separately or common mode) –7 12 V
V
IH
High-level input voltage D, LBK 2 5.5 V
V
IL
Low-level input voltage D, LBK 0 0.8 V
V
ID
Differential input voltage –6 6 V
Resistance from R
S
to ground 0 100 kΩ
V
I(Rs)
Input voltage at R
S
for standby 0.75 V
CC
5.5 V
Driver –50
I
OH
High-level output current mA
Receiver –10
Driver 50
I
OL
Low-level output current mA
Receiver 10
T
J
Operating junction temperature 212 °C
T
A
Operating free-air temperature
(1)
-55 210 °C
(1) Maximum free-air temperature operation is allowed as long as the device maximum junction temperature is not exceeded.
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