Datasheet

a
b
c
d
Origin
SN65HVD233-HT
www.ti.com SLLS933F –NOVEMBER 2008–REVISED AUGUST 2012
BARE DIE INFORMATION
BACKSIDE BOND PAD
DIE THICKNESS BACKSIDE FINISH
POTENTIAL METALLIZATION COMPOSITION
15 mils. Silicon with backgrind GND Al-Si-Cu (0.5%)
Table 1. Bond Pad Coordinates in Microns - Rev A
DISCRIPTION PAD NUMBER a b c d
D 1 86.40 157.85 203.40 274.85
GND 2 1035.05 69.75 1150.05 184.75
GND 3 1168.15 69.75 1283.15 184.75
VCC 4 1572.05 51.85 1687.05 166.85
VCC 5 1711.95 51.85 1826.95 166.85
R 6 2758.85 237.65 2873.85 352.65
LBK 7 2774.25 1429.985 2889.25 1544.95
CANL 8 1549.90 1544.95 1664.90 1659.95
CANH 9 1351.45 1544.95 1466.45 1659.95
RS 10 83.50 1429.95 198.50 1544.95
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