Datasheet

SN65HVD21A
SLLSE36 –DECEMBER 2010 www.ti.com
THERMAL INFORMATION
SN65HVD21A
THERMAL METRIC
(1)
SOIC (D) UNITS
8 PINS
q
JA
Junction-to-ambient thermal resistance 78.1
q
JCtop
Junction-to-case (top) thermal resistance 56.5
q
JB
Junction-to-board thermal resistance 50.44
°C/W
y
JT
Junction-to-top characterization parameter 4.1
y
JB
Junction-to-board characterization parameter 32.6
q
JCbot
Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
POWER DISSIPATION
PARAMETERS TEST CONDITIONS VALUE UNIT
V
CC
= 5 V, T
J
= 25°C,
R
L
= 54 Ω, C
L
= 50 pF (driver),
Typical C
L
= 15 pF (receiver), 5 Mbps 260 mW
50% Duty cycle square-wave signal,
Driver and receiver enabled
Device Power
dissipation, P
D
V
CC
= 5.5 V, T
J
= 125°C,
R
L
= 54 Ω, C
L
= 50 pF,
Worst case C
L
= 15 pF (receiver), 5 Mbps 342 mW
50% Duty cycle square-wave signal,
Driver and receiver enabled
Thermal shut down junction temperature, T
SD
170 °C
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