Datasheet
SN65HVD11-HT
www.ti.com
SLLS934E –NOVEMBER 2008–REVISED JUNE 2012
THERMAL CHARACTERISTICS FOR JD PACKAGE
over operating free-air temperature range unless otherwise noted
(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
High-K board
(3)
, No airflow JD pkg 64.9
Junction-to-ambient thermal
θ
JA
°C/W
resistance
(2)
No airflow JD pkg 83.4
Junction-to-board thermal
θ
JB
High-K board without underfill JD pkg 27.9 °C/W
resistance
Junction-to-case thermal
θ
JC
JD pkg 6.49 °C/W
resistance
R
L
= 60 Ω, C
L
= 50 pF,
DE = V
CC
, RE = 0 V, HVD11
P
D
Device power dissipation 165 mW
Input to D a 50% duty cycle square (10 Mbps)
wave at indicated signaling rate
(1) See Application Information section for an explanation of these parameters.
(2) The intent of θ
JA
specification is solely for a thermal performance comparison of one package to another in a standardized environment.
This methodology is not meant to and will not predict the performance of a package in an application-specific environment.
(3) JED51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
THERMAL CHARACTERISTICS FOR HKJ OR HKQ PACKAGE
over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
to ceramic side of case 5.7
θ
JC
Junction-to-case thermal resistance °C/W
to top of case lid (metal side of case) 13.7
RECOMMENDED OPERATING CONDITIONS
T
A
= –55°C to 125°C T
A
= 175°C T
A
= 210°C
UNIT
MIN NOM MAX MIN NOM MAX MIN NOM MAX
V
CC
Supply voltage 3 3.6 3 3.6 3 3.6 V
V
I
or
Voltage at any bus terminal (separately or common mode) -7
(1)
12 -7
(1)
12 -7
(1)
12 V
V
IC
V
IH
High-level input voltage D, DE, RE 2 V
CC
2 V
CC
2 V
CC
V
V
IL
Low-level input voltage D, DE, RE 0 0.8 0 0.8 0 0.8 V
V
ID
Differential input voltage Figure 8 -12 12 -12 12 -12 12 V
Driver -60 -60 -60
I
OH
High-level output current mA
Receiver -8 -8 -8
Driver 60 60 60
I
OL
Low-level output current mA
Receiver 8 8 8
R
L
Differential load resistance 54 60 54 60 54 60 Ω
C
L
Differential load capacitance 50 50 50 pF
Signaling rate 10 10 10 Mbps
T
J
(2)
Operating junction temperature 129 179 214 °C
(1) The algebraic convention, in which the least-positive (most-negative) limit is designated as minimum, is used in this data sheet.
(2) See Thermal Characteristics table for information regarding this specification.
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