Datasheet

1
2
3
4
6
7
A
B
R
RE
DE
D
SN65HVD11-HT
SLLS934E –NOVEMBER 2008–REVISED JUNE 2012 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
SIGNALING RATE UNIT LOADS T
A
PART NUMBER PACKAGE TYPE TOP-SIDE MARKING
10 Mbps 1/8 –55°C to 210°C SN65HVD11SJD CDIP SN65HVD11SJD
10 Mbps 1/8 –55°C to 210°C SN65HVD11SKGDA Bare Die
10 Mbps 1/8 –55°C to 210°C SN65HVD11SHKJ CFP SN65HVD11SHKJ
10 Mbps 1/8 –55°C to 210°C SN65HVD11SHKQ CFP HVD11SHKQ
10 Mbps 1/8 –55°C to 175°C SN65HVD11HD SOIC HD11
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
FUNCTIONAL BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATINGS
(1) (2)
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
V
CC
Supply voltage range –0.3 to 6 V
Voltage range at A or B –9 to 14 V
Input voltage range at D, DE, R, or RE –0.5 to V
CC
+ 0.5 V
Voltage input range, transient pulse, A and B, through 100 Ω (see Figure 12) –50 to 50 V
I
O
Receiver output current range –11 to 11 mA
A, B, and GND 16
Human-Body Model
(HBM)
(3)
All pins 4
Electrostatic discharge kV
Charged-Device Model
All pins charge 1
(CDM)
(4)
Continuous total power dissipation See Dissipation Ratings Table
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-A.
(4) Tested in accordance with JEDEC Standard 22, Test Method C101.
THERMAL CHARACTERISTICS FOR D PACKAGE
over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
θ
JC
Junction-to-case thermal resistance (to bottom of case) 39.4 °C/W
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