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HKQ PACKAGE

(TOP VIEW)

HKQ as formed or HKJ mounted dead bug

GND

D, JD OR HKJ PACKAGE

(TOP VIEW)

SN65HVD11-HT

www.ti.com

SLLS934E –NOVEMBER 2008–REVISED JUNE 2012

3.3-V RS-485 TRANSCEIVER

Check for Samples: SN65HVD11-HT

FEATURES

SUPPORTS EXTREME TEMPERATURE

APPLICATIONS

• Operates With a 3.3-V Supply

• Controlled Baseline

• Bus-Pin ESD Protection Exceeds 16-kV

Human-Body Model (HBM) • One Assembly/Test Site

• 1/8 Unit-Load Option Available (up to 256 • One Fabrication Site

Nodes on Bus)

• Available in Extreme (–55°C/210°C)

• Optional Driver Output Transition Times for Temperature Range

(2)

Signaling Rates

(1)

of 1 Mbps, 10 Mbps, and

• Extended Product Life Cycle

32 Mbps

• Extended Product-Change Notification

• Based on ANSI TIA/EIA-485-A

• Product Traceability

• Bus-Pin Short Circuit Protection From

• Texas Instruments' high temperature products

–7 V to 12 V

utilize highly optimized silicon (die) solutions

• Open-Circuit, Idle-Bus, and Shorted-Bus Fail-

with design and process enhancements to

Safe Receiver

maximize performance over extended

• Glitch-Free Power-Up and Power-Down temperatures.

Protection for Hot-Plugging Applications

• SN75176 Footprint

APPLICATIONS

• Down-Hole Drilling

• High Temperature Environments

• Digital Motor Controls

• Utility Meters

• Chassis-to-Chassis Interconnects

• Electronic Security Stations

• Industrial Process Control

• Building Automation

• Point-of-Sale (POS) Terminals and Networks

(1) The signaling rate of a line is the number of voltage

transitions that are made per second expressed in the units

bits per second (bps). (2) Custom temperature ranges available

DESCRIPTION/ORDERING INFORMATION

The SN65HVD11 combines a 3-state differential line driver and differential input line receiver that operates with a

single 3.3-V power supply. It is designed for balanced transmission lines and meets or exceeds ANSI TIA/EIA-

485-A and ISO 8482:1993, with the exception that the thermal shutdown is removed. This differential bus

transceiver is a monolithic integrated circuit designed for bidirectional data communication on multipoint bus-

transmission lines. The driver and receiver have active-high and active-low enables, respectively, that can be

externally connected together to function as direction control.

The driver differential outputs and receiver differential inputs connect internally to form a differential input/ output

(I/O) bus port that is designed to offer minimum loading to the bus when the driver is disabled or V

= 0.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (29 pages)

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SN65HVD11-HT www.ti.com SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 3.3-V RS-485 TRANSCEIVER Check for Samples: SN65HVD11-HT FEATURES 1 • • • • • • • • • Operates With a 3.
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SN65HVD11-HT SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 www.ti.com BARE DIE INFORMATION DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION 15 mils. Silicon with backgrind GND Cu-Ni-Pd Table 1. Bond Pad Coordinates in Microns - Rev A DESCRIPTION (1) 2 (1) PAD NUMBER a b c d R 1 69.30 372.15 185.30 489.15 ~RE 2 388.75 71.50 503.75 186.50 DNC 3 722.40 55.40 839.40 172.40 DNC 4 891.40 55.40 1008.40 172.40 DE 5 1174.80 71.50 1289.
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SN65HVD11-HT www.ti.
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SN65HVD11-HT SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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SN65HVD11-HT www.ti.com SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 THERMAL CHARACTERISTICS FOR JD PACKAGE over operating free-air temperature range unless otherwise noted PARAMETER θJA Junction-to-ambient thermal resistance (2) θJB Junction-to-board thermal resistance θJC Junction-to-case thermal resistance PD (1) (2) (3) Device power dissipation (1) TEST CONDITIONS High-K board MIN (3) , No airflow TYP MAX UNIT JD pkg 64.9 No airflow JD pkg 83.
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SN65HVD11-HT SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 www.ti.com DRIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER VIK Input clamp voltage |VOD| Differential output voltage TA = 175°C (1) TA = –55°C to 125°C TEST CONDITIONS MIN II = –18 mA TYP MAX –1.5 IO = 0 MIN TYP TA = 210°C (2) MAX –1.5 2 VCC MIN TYP MAX –1.5 2 VCC V 2 RL = 54 Ω, See Figure 2 1.0 1 1 Vtest = –7 V to 12 V, See Figure 3 1.0 1 1 -0.
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SN65HVD11-HT www.ti.
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SN65HVD11-HT SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 www.ti.com RECEIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TA = 175°C (1) TA = –55°C to 125°C TEST CONDITIONS MIN TYP MAX MIN TYP TA = 210°C (2) MAX MIN TYP MAX UNIT VIT+ Positive-going input threshold voltage IO = –8 mA VIT– Negative-going input threshold voltage IO = 8 mA Vhys Hysteresis voltage (VIT+ –VIT–) VIK Enable-input clamp voltage II = –18 mA –1.5 –1.
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SN65HVD11-HT www.ti.
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SN65HVD11-HT SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 www.ti.com xxx Estimated Life (Hours) 1000000 100000 Electromigration Fail Mode 10000 1000 110 Wirebond Fail Mode 120 130 140 150 160 170 180 190 200 210 Continuous TJ (°C) (1) See data sheet for absolute maximum and minimum recommended operating conditions. (2) Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life). (3) The predicted operating lifetime vs.
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SN65HVD11-HT www.ti.com SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 PARAMETER MEASUREMENT INFORMATION VCC DE II 375 Ω ±1% VCC IOA A DE VOD 0 or 3 V B 54 Ω ±1% 0 or 3 V D A VOD IOB 60 Ω ±1% + _ −7 V < V(test) < 12 V B VI VOB 375 Ω ±1% VOA Figure 2. Driver VOD Test Circuit and Voltage and Current Definitions VCC DE Input D Figure 3. Driver VOD With Common-Mode Loading Test Circuit 27 Ω ± 1% A A VA B VB VOC(PP) 27 Ω ± 1% B CL = 50 pF ±20% VOC ∆VOC(SS) VOC A.
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SN65HVD11-HT SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 3V RL = 110 Ω ± 1% A 3V VI 1.5 V VI S1 D 1.5 V VO DE Input Generator ≈3V 50 Ω 0V B tPZL tPLZ ≈3V CL = 50 pF ±20% 0.5 V CL Includes Fixture and Instrumentation Capacitance VO 2.3 V VOL Generator: PRR = 500 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, Zo = 50 Ω Figure 7.
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SN65HVD11-HT www.ti.com SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 PARAMETER MEASUREMENT INFORMATION (continued) 3V 3V A DE 0 V or 3 V R D VO B RE Input Generator VI A 1 kΩ ± 1% S1 CL = 15 pF ±20% B CL Includes Fixture and Instrumentation Capacitance 50 Ω Generator: PRR = 500 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, Zo = 50 Ω 3V VI 1.5 V 1.5 V 0V tPZH(1) tPHZ VOH –0.5 V VOH D at 3 V S1 to B 1.5 V VO ≈0V tPZL(1) tPLZ ≈3V VO 1.5 V VOL +0.5 V D at 0 V S1 to A VOL Figure 10.
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SN65HVD11-HT SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 3V A 0 V or 1.5 V R B 1.5 V or 0 V RE Input Generator VI A 1 kΩ ± 1% VO S1 CL = 15 pF ±20% B CL Includes Fixture and Instrumentation Capacitance 50 Ω Generator: PRR = 100 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, Zo = 50 Ω 3V 1.5 V VI 0V tPZH(2) VOH A at 1.5 V B at 0 V S1 to B 1.5 V VO GND tPZL(2) 3V 1.5 V VO A at 0 V B at 1.5 V S1 to A VOL Figure 11.
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SN65HVD11-HT www.ti.com SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 PARAMETER MEASUREMENT INFORMATION (continued) FUNCTION TABLES Table 2. DRIVER (1) OUTPUTS (1) INPUT D ENABLE DE A B H H H L L H L H X L Z Z Open H H L H = high level L = low level Z = high impedance X = irrelevant ? = indeterminate Table 3. RECEIVER (1) DIFFERENTIAL INPUTS VID = VA - VB ENABLE RE OUTPUT R VID ≤ −0.2 V L L −0.2 V < VID < −0.01 V L ? −0.
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SN65HVD11-HT SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 www.ti.
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SN65HVD11-HT www.ti.com SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 TYPICAL CHARACTERISTICS RMS SUPPLY CURRENT vs SIGNALING RATE BUS INPUT CURRENT vs BUS INPUT VOLTAGE 70 90 RL = 54 Ω CL = 50 pF 80 VCC = 3.6 V 70 I I − Bus Input Current − µ A I CC − RMS Supply Current − mA TA = 25°C RE at VCC DE at VCC 60 50 VCC = 3 V VCC = 3.3 V 40 TA = 25°C DE at 0 V 60 50 VCC = 0 V 40 30 20 10 0 VCC = 3.3 V −10 −20 −30 −40 −50 30 0 2.5 5 7.
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SN65HVD11-HT SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) DRIVER DIFFERENTIAL OUTPUT vs FREE-AIR TEMPERATURE DRIVER OUTPUT CURRENT vs SUPPLY VOLTAGE 2.5 2.3 VCC = 3.3 V VTest = 12 V 2.2 2.1 2.0 1.9 1.8 1.7 −30 −25 −20 −15 −10 −5 1.6 1.5 -100 TA = 25°C DE at VCC D at VCC RL = 54 Ω −35 I O − Driver Output Current − mA VOD – Driver Differential Output – V 2.4 −40 0 -50 0 50 100 150 200 0 250 0.50 1 1.50 2 2.50 3 3.
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SN65HVD11-HT www.ti.com SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 TYPICAL CHARACTERISTICS (continued) 375 W ± 1% Y D 0 or 3 V -7 V < V(TEST) < 12 V VOD 60 W ± 1% Z DE 375 W ± 1% Input Generator V 50 W 50% tpZH(diff) VOD (high) 1.5 V 0V tpZL(diff) -1.5 V VOD (low) Figure 20. Driver Enable Time From DE to VOD The time tpZL(x) is the measure from DE to VOD(x). VOD is valid when it is greater than 1.5 V.
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SN65HVD11-HT SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 www.ti.com APPLICATION INFORMATION 256 Devices on Bus Figure 21.
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SN65HVD11-HT www.ti.com SLLS934E – NOVEMBER 2008 – REVISED JUNE 2012 THERMAL CHARACTERISTICS OF IC PACKAGES θJA (Junction-to-Ambient Thermal Resistance) is defined as the difference in junction temperature to ambient temperature divided by the operating power.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.