Datasheet

SN65HVD1050-Q1
SLLS696C –MAY 2006–REVISED DECEMBER 2010 www.ti.com
THERMAL CHARACTERISTICS
over recommended operating conditions including operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Low-K thermal resistance
(1)
211
q
JA
Junction-to-air thermal resistance °C/W
High-K thermal resistance 131
q
JB
Junction-to-board thermal resistance 53 °C/W
q
JC
Junction-to-case thermal resistance 79 °C/W
V
CC
= 5 V, T
J
= 27°C, R
L
= 60 Ω, S at 0 V,
Input to TXD at 500 kHz, 50% duty cycle square wave, 112
CL at RXD = 15 pF
P
D
Average power dissipation mW
V
CC
= 5.5 V, T
J
= 130°C, R
L
= 45 Ω, S at 0 V,
Input to TXD at 500 kHz, 50% duty cycle square wave, 170
CL at RXD = 15 pF
Thermal shutdown temperature 190 °C
(1) Tested in accordance with the low-K or high-K thermal metric definitions of EIA/JESD51-3 for leaded surface-mount packages.
FUNCTION TABLES
Table 1. DRIVER
(1)
INPUTS OUTPUTS
BUS STATE
TXD S CANH CANL
L L or Open H L Dominant
H X Z Z Recessive
Open X Z Z Recessive
X H Z Z Recessive
(1) H = high level, L = low level, X = irrelevant, ? = indeterminate, Z = high impedance
Table 2. RECEIVER
(1)
DIFFERENTIAL INPUTS OUTPUT
BUS STATE
V
ID
= V(CANH) – V(CANL) RXD
V
ID
≥ 0.9 V L Dominant
0.5 V < V
ID
< 0.9 V ? ?
V
ID
≤ 0.5 V H Recessive
Open H Recessive
(1) H = high level, L = low level, X = irrelevant, ? = indeterminate, Z = high impedance
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