Datasheet
SN65HVD1050A-Q1
SLLS888A –JUNE 2008–REVISED JANUARY 2011
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S PIN CHARACTERISTICS
over recommended operating conditions, T
A
= –40 to 125°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
I
IH
High level input current S at 2 V 20 40 70 mA
I
IL
Low level input current S at 0.8 V 5 20 30 mA
(1) All typical values are at 25°C with a 5-V supply.
V
ref
PIN CHARACTERISTICS
(1)
over recommended operating conditions, T
A
= –40 to 125°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
O
Reference output voltage –50 mA < I
O
< 50 mA 0.4 V
CC
0.5 V
CC
0.6 V
CC
V
(1) Available only on SN65HVD1050A, not on SN65HVD1050AL.
(2) All typical values are at 25°C with a 5-V supply.
THERMAL CHARACTERISTICS
over recommended operating conditions, T
A
= –40 to 125°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Low-K thermal resistance
(2)
211
q
JA
Junction-to-air thermal resistance
(1)
°C/W
High-K thermal resistance
(2)
131
q
JB
Junction-to-board thermal resistance 53 °C/W
q
JC
Junction-to-case thermal resistance 79 °C/W
V
CC
= 5 V, T
J
= 27°C, R
L
= 60 Ω, S at 0 V,
Input to TXD at 500 kHz, 50% duty cycle square wave, 112
CL at RXD = 15 pF
P
D
Average power dissipation mW
V
CC
= 5.5 V, T
J
= 130°C, R
L
= 45 Ω, S at 0 V,
Input to TXD at 500 kHz, 50% duty cycle square wave, 170
CL at RXD = 15 pF
Thermal shutdown temperature 190 °C
(1) The junction temperature (T
J
) is calculated using the following T
J
= T
A
+ (P
D
* q
JA
).
(2) Tested in accordance with the Low-K (EIA/JESD51-3) or High-K (EIA/JESD51-7) thermal metric definitions for leaded surface-mount
packages.
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