Datasheet

SN65HVD1040-Q1
SLLS753D –FEBRUARY 2007– REVISED AUGUST 2011 www.ti.com
THERMAL CHARACTERISTICS
over recommended operating conditions including operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Low-K thermal resistance
(1)
211
θ
JA
Junction-to-air thermal resistance °C/W
High-K thermal resistance 131
θ
JB
Junction-to-board thermal resistance 53 °C/W
θ
JC
Junction-to-case thermal resistance 79 °C/W
V
CC
= 5 V, T
J
= 27°C, R
L
= 60 Ω, STB at 0 V,
Input to TXD at 500 kHz, 50% duty cycle 112
square wave, C
L
at RXD = 15 pF
P
D
Average power dissipation mW
V
CC
= 5.5 V, T
J
= 130°C, R
L
= 45 Ω, STB at 0 V,
Input to TXD at 500 kHz, 50% duty cycle 170
square wave, C
L
at RXD = 15 pF
Thermal shutdown temperature 185 °C
(1) Tested in accordance with the low-K or high-K thermal metric definitions of EIA/JESD51-3 for leaded surface-mount packages.
FUNCTION TABLES
Table 1. DRIVER
(1)
INPUTS OUTPUTS
BUS STATE
TXD STB CANH CANL
L L H L Dominant
H L Z Z Recessive
Open L Z Z Recessive
X H or Open Y Y Recessive
(1) H = high level, L = low level, X = irrelevant, ? = indeterminate, Y = weak pulldown do GND, Z = high
impedance
Table 2. RECEIVER
(1)
DIFFERENTIAL INPUTS OUTPUT
STB BUS STATE
V
ID
= V(CANH) – V(CANL) RXD
V
ID
≥ 0.9 V L L Dominant
V
ID
≥ 1.15 V H or Open L Dominant
0.5 V < V
ID
< 0.9 V X ? ?
V
ID
≤ 0.5 V X H Recessive
Open X H Recessive
(1) H = high level, L = low level, X = irrelevant, ? = indeterminate, Z = high impedance
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