Datasheet

DEVICE INFORMATION
THERMAL CHARACTERISTICS
SN65HVD1040
SLLS631D – MARCH 2007 – REVISED DECEMBER 2008 ............................................................................................................................................... www.ti.com
Table 2. DRIVER FUNCTION TABLE
(1)
INPUTS OUTPUTS BUS STATE
TXD STB CANH CANL
L L H L DOMINANT
H L Z Z RECESSIVE
Open X Z Z RECESSIVE
X H or Open Z Z RECESSIVE
(1) H = high level; L = low level; X = irrelevant; Z = high impedance
Table 3. RECEIVER FUNCTION TABLE
(1)
DIFFERENTIAL INPUTS STB OUTPUT BUS STATE
V
ID
= CANH - CANL RXD
V
ID
≥ 0.9 V L L DOMINANT
V
ID
≥ 1.15 V H or Open L DOMINANT
0.5 V < V
ID
< 0.9 V X ? ?
V
ID
≤ 0.5 V X H RECESSIVE
Open X H RECESSIVE
(1) H = high level; L = low level; X = irrelevant; ? = indeterminate; Z =
high impedance
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Low-K Thermal Resistance
(1)
211 ° C/W
θ
JA
Thermal Resistance, Junction-to-Air
High-K Thermal Resistance 131 ° C/W
θ
JB
Thermal Resistance, 53
Junction-to-Board
° C/W
θ
JC
Thermal Resistance, Junction-to-Case 79
R
L
= 60 Ω , S at 0 V,
P
D
Device Power Dissipation 112 170 mW
Input to TXD a 500kHz 50% duty-cycle square wave
T
JS
Junction Temperature, Thermal Shutdown
(2)
190 ° C
(1) Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.
(2) Extended operation in thermal shutdown may affect device reliability, see the Application Information section.
10 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): SN65HVD1040