Datasheet
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ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
PACKAGE DISSIPATION RATINGS
SN65CML100
SLLS547 – NOVEMBER 2002
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PART NUMBER PART MARKING PACKAGE STATUS
SN65CML100D CML100 SOIC Production
SN65CML100DGK NWB MSOP Production
over operating free-air temperature range unless otherwise noted
(1)
UNIT
V
CC
Supply voltage range
(2)
–0.5 V to 4 V
I
BB
Sink/source ± 0.5 mA
Voltage range, (A, B, Y, Z) 0 V to 4.3 V
A, B, Y, Z, and GND ± 5 kV
Human Body Model
(3)
Electrostatic
All pins ± 2 kV
discharge
Charged-Device Model
(4)
All pins ± 1500 V
Continuous power dissipation See Dissipation Rating Table
T
stg
Storage temperature range –65 ° C to 150 ° C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-A.7.
(4) Tested in accordance with JEDEC Standard 22, Test Method C101.
MIN NOM MAX UNIT
V
CC
Supply voltage 3 3.3 3.6 V
3.3-V nominal supply at terminator 3 3.3 3.6
V
V
TT
Terminator supply voltage 2.5-V nominal supply at terminator 2.375 2.5 2.625
1.8-V nominal supply at terminator 1.7 1.9 V
|V
ID
| Magnitude of differential input voltage 0.1 1 V
Input voltage (any combination of common-mode or input signals) 0 4 V
V
BB
Output current 400 µ A
T
A
Operating free-air temperature –40 85 ° C
T
A
≤ 25 ° C DERATING FACTOR
(1)
T
A
= 85 ° C
PACKAGE
POWER RATING ABOVE T
A
= 25 ° C POWER RATING
DGK 425 mW 3.4 mW/ ° C 221 mW
D 725 mW 5.8 mW/ ° C 377 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
2
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